Today's card uses several of the products included in the Kintsugi Inspirations Suite and all of the "Kintsugi repairs" are made with copper embossing powder.
The background was embossed with the Joined Together 3D embossing folder which is one of the products in the suite. The "cracks" in the background where heat embossed with Copper embossing powder (EP).
I experimented with a couple different ways to add the Copper EP in the cracks. My first attempt was to add VersaMark ink to the raised "cracks" on the embossing folder and then dry embossed the Basic White cardstock. After dry embossing, I added Copper embossing powder to the embossed Basic White cardstock and heat embossed. However, the "cracks" were not covered with copper as much as I envisioned. So, I then took that same embossed Basic White cardstock and used a VersaMark Pen to add additional ink to the debossed cracks and heat embossed a second time with Copper EP. That filled in the "cracks" nicely.
If I make a second card, I think I will skip the first attempt and use only the 2nd process.
The vase was stamped with VersaMark ink on Basic White and heat embossed with Copper EP. I used the coordinating Inspiring Imperfections dies from the bundle to die cut the vase.
To add just a bit of color, I used a Blending Brush with Lost Lagoon ink to highlight the vase.
The bouquet in the vase was created with two additional dies from the bundle. The "flowers" (I'm not really sure what those are, but they qualify as flowers for me.) were die cut from copper foil. To create the "twig" in the vase, I used the longer of the two Kintsugi crack dies to die cut a twig from Blackberry Bliss cardstock.
The twig and the flowers were arranged in the vase and the assembly was adhered to the focal point.
The sentiment from Inspiring Imperfections was heat embossed with white embossing powder on Blackberry Bliss cardstock and die cut with another of the dies from the die bundle.